PLUG617R Uncooled Thermal Core
Infrared Thermal Camera Module Core 640x512 / 17μM For Industrial Thermography
Product Description
PLUG617R uncooled thermal camera module consists of 640x512 / 17μm uncooled fpa infrared detector, full series of optical components, professional signal processing circuit and image processing algorithm.
PLUG617R is a kind of uncooled camera module applied in the field of industrial thermal imaging and temperature measurement. The temperature range is customizable, which can meet the specific requirements of industrial thermography and present a clear thermal image.
As a leading thermal camera module manufacturers, Global Sensor technology is committed to opening a new vision for industrial temperature measurement. After years of technical accumulation and practical experience in the field of infrared temperature measurement, we have provided our customers a full range of machine thermal imaging vision solutions.
Main Features
- NETD<30mk, High Sensitivity
- Stable Performance
- Easy Integration
- Clear Image Quality & Details
- Customizable Temperature Range
- Strong Environmental Adaptability
Product Specifications
| Model | PLUG617R |
| IR Detector Performance |
| Resolution | 640x512 |
| Pixel Pitch | 17μm |
| Spectral Range | 8~14μm |
| NETD | <30mk |
| Image Processing |
| Frame Rate | 25Hz/30Hz |
| Start-up Time | <15s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV/BT656/LVDS |
| Extension Component | USB/Camerlink |
| Dimming Mode | Linear/Histogram/Mixed |
| Digital Zoom | 1~8X Continual Zoom, Step Size 1/8 |
| Image Display | Black Hot/White Hot/Pseudo Color |
| Image Direction | Horizontally/Vertically/Diagonally Flip |
| Image Algorithm | NUC/AGC/IDE |
| Electrical Specification |
| Standard External Interface | 50pin_HRS Interface |
| Communication Mode | RS232-TTL, 115200bps |
| Supply Voltage | 4~6V |
| Temperature Measurement |
| Operating Temperature Range | -10°C~50°C |
| Temperature Range | -20°C~150°C, 100°C~550°C |
| Temperature Accuracy | ±2°C or ±2% (Take the Maximum Value) |
| SDK | ARM/Windows/Linux SDK, Full Screen Thermography |
| Physical Characteristics |
| Dimension (mm) | 44.5x44.5x36.6 |
| Weight | <90g |
| Environmental Adaptation |
| Operation Temperature | -40°C ~ +70°C |
| Storage Temperature | -45°C ~ +85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | Random Vibration 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Optics |
| Optional Lens | Fixed Focus Athermal: 7.5mm/13mm/19mm/25mm/35mm
Motorized Lens: 75mm/100mm/150mm |
Industrial Applications
The PLUG617R thermal imaging module is widely used in Electric Power Inspection, Machine Vision, Building HVAC Security & Monitoring, Outdoors, Firefighting & Rescue, Law Enforcement & Rescue, ADAS, UAV Payloads etc.
Global Sensor Technology Team
FAQs
1. About ceramic packaging infrared detector
Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. For ceramic packaging, its readout circuit has self-adjusting operating temperature function and does not require TEC stabilization.
2. Wafer Level Packaging
Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.
It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.
Product Tags:
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Clear Image Infrared Thermal Camera Module Core 640x512 17μM For ADAS Images
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